Inspection modules for semiconductor

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    INSPECTION MODULES

    FOR THE SEMICONDUCTOR INDUSTRY

    EUV Mask Inspection is a critical part of the mask making process for extreme ultraviolet (EUV) lithograhy. During the process, defects or particles may surface on the EUV mask. It is critical to inspect the EUV mask using a mask inspection system.

    So, for the design of such a system, Nedinsco uses its in-house know-how on microscopes, optics, lenses and precision mechanics to design and produce a wide range of inspection modules to be integrated in mask inspection systems for the semiconductor industry. All of our inspection modules are a necessity in maks inspection to achieve the desired accuracy while maintaining a very high level of stability.

    Nedinsco’s Beam Delivery Systems, microscope heads for waver inspection, laser spot measurement modules, and other opto-mechatronic tools are key modules to achieve the desired accuracy, quality and stability in mask inspection systems.

    EXPERTISE

    Nedinsco has all the necessary experience and in-depth knowledge directly in-house

    HIGH-PRECISION

    High-precision tooling that meets the requirements of the semiconductor industry

    TOP QUALITY

    To ensure optimal quality, we offer in-house cleanroom assembly and qualification testing

    OPTIMIZATION

    Depending on your application, we can help you choose the perfect materials to optimize your production process.

    Beam Delivery System

    EUV lithography technology is indispensable for the fabrication process of highly integrated  semiconductor devices. Meanwhile, mask inspection with the EUV light source to detect defects in high-precision masks needs to be implemented to establish an EUV lithography mass production technology.

    A Beam Delivery System is used to produce the EUV light source used for EUV mask inspection. The opto-mechatronic system continuously aligns two independent laser beams to land on the exact same spot, where tin is evaporated on the electrode with this laser trigger to create the EUV light. Nedinsco designs and manufactures the opto-mechanical module, which is actually the heart of an EUV inspection machine.

    Beam Measurement Module

    In the semiconductor industry, lasers are being used for many applications. For most of these applications, the laser spot should be fully controlled in terms of power, diameter, circularity, etc. For example for micro laser soldering in a die bonder or a flip chip bonder, it is crucial to have full control over your laser spot. Another application is the EUV light source for EUV inspection machines. Nedinsco has developed the laser spot measurement modules for these machines.

    Nedinsco develops and produces laser spot modules for integration in these machines. These modules consist of a specific housing, optic components like mirrors and lenses, as well as the camera, electronics and software.

    From idea, to concept, to series production, Nedinsco supports and advises throughout this process in close cooperation with the customer.

    Depth-View ProTM

    Our Depth View ProTM is a sublime vision system that brings 3D objects into sharp focus with the finest detail and at the highest speed.

    By combining a unique optical design with state-of-the-art intelligent algorithms, the vision system increases the depth of field more than ten times compared to traditional vision systems, with no loss of resolution or frame rate. By increasing the depth of field, objects can be brought into sharp focus over a greater depth and distance.

    Depth View ProTM provides a solution for all applications requiring a vision system that can capture images with superior depth of field without loss of resolution or imaging speed.

    The system particularly lends itself to microscopic applications where problems of limited depth of field are most common. However, the technology can also be used for a range of microscopic applications.

    Typical applications for the Depth View Pro vision system include wafer inspection after wafer dicing, wire bonding inspection, PCB inspection, CD overlay inspection, and more.

    Microscope Heads for Wafer Inspection (UV)

    During the wafer inspection process, it may happen that an error is discovered during the gross inspection. At that stage microscopic inspection is required.

    Nedinsco designs specific multi-microscope heads, which contain up to 7 objectives with different zoom ranges. Nedinsco microscope heads are integrated into a fully automated inspection line.

    The microscope heads are designed according to customer specifications, and during that process our experts will advise you on the best optics, electronics and mechanics needed for this module.

    Contact our specialists today with your request

    Nedinsco has all the necessary experience and in-depth knowledge directly in-house. Nedinsco distinguishes itself by supplying high-quality equipment that meets the requirements of the semiconductor industry, both today and in the future.

    Nedinsco can help you define all specifications in cooperation with you as our customer. Even when your optics design is already defined, we can support with the mechanical integration.

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